Products > Kalrez® > News Press Releases 6/24/2010 DuPont Performance Polymers Introduces Zalak® 5300 Seals for Cost-Effective Sealing in Photovoltaic Crystalline Silicon and Thin Film Manufacturing DuPont Performance Polymers (DuPont) will introduce DuPontTM Zalak® 5300 high-performance seals for photovoltaic cell manufacturing at Intersolar Booth 8159 in San Francisco, July 13-15. Zalak® 5300 seals bridge the performance gap between standard fluoroelastomers (FKM) and perfluoroelastomers (FFKM) seals. Zalak® 5300 seals are specially formulated for use in plasma environments, such as edge isolation, ARC coating in crystalline cell manufacturing, TCO sputtering deposition, and selective a-Si PECVD applications in PV cell manufacturing. Click here for full story   4/13/2010 Advance in DuPontTM Kalrez® Parts Overcomes Challenges of Harsh Oil and Gas Environments Reliability engineering for harsh oil and gas drilling environments such as deep water and shale has just taken a major step forward with the advent of DuPontTM Kalrez® 0090 perfluoroelastomer O-rings. Click here for full story   10/29/2009 How To Reduce Outgassing, Improve Processing In High Vacuum Manufacturing Processes Semiconductor wafer processors who need to reduce the effect of outgassing from sealing materials in high vacuum environments will benefit from recent testing conducted by DuPont Performance Elastomers (DPE). In a DPE technical paper titled, "Outgassing Characterization of Elastomeric Seals Used in Semiconductor Wafer Processing," presented Nov. 9 at the American Vacuum Society (AVS) in San Jose, Calif., DPE reviews a testing protocol for elastomers that demonstrates that outgassing can be significantly reduced by selecting sealing materials that have been appropriately developed and tested for minimal outgassing. Click here for full story   Trademarks, Terms Of Use, Privacy, and Copyright© 1996-2010 DuPont Performance Elastomers. All rights reserved. DuPont™ is a trademark of DuPont and its affiliates. Copyright© 2010. All rights reserved.